Ehsan K.Ardestani and Jose Renau
10/06/2009 09:00 AM
Computer Engineering
This report provides a set of thermal measurements to give more insight into the thermal behaviour of processor packages. Using a test chip, up to two blocks in the chip is powered up to various power densities and frequencies. Thermal response of several blocks across the chip is captured. As a result, this set of measured power and temperature traces provides the basic data for spacial and temporal analysis of power to temperature mappings.
